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International
Labour Organization


Your health and safety at work

CHEMICALS IN THE WORKPLACE

Appendix X: Chemical groups

Health hazards in the electronics industry, lnternational Metalworkers' Federation, Asia Monitor Resource Centre, Hong Kong, 1985.

Chemicals used or occurring in electronics manufacturing are listed here under general groups. This chemical groups list can be used (1) to identify specific names of chemicals, and (2) to group chemicals generally according to use and type of hazard. For example, you are using certain acids, but are not sure what specific kinds. The group list for acids provides specific names which may help you to identify the acids you are using.

Acids

Acids are corrosive substances widely used throughout the industry for cleaning, etching, plating and stripping. They are usually in liquid or powder form. Most are acutely hazardous, especially when concentrated. Acids can penetrate clothing rapidly causing serious burns and damage to tissues beneath the skin. Protective gear is essential, especially for the hands, face, eyes and lungs. All corrosives should be labeled clearly with warning placards.

Organic acids lnorganic Acids
acetic acid aqua regia
adipic acid buffered oxide etch
citric acid boric acid
formic acid chromic acid
lactic acid hydrobromic acid
oxalic acid hydrochioric acid
hydrocyanic acid
hydrofluoric acid
hydrofluoric acid
nitric acid
phosphoric acid
sulfonic acid
sulfuric acid

Alkalis (Bases)

Alkaline or base substances are used primarily for cleaning and scouring. Like acids, they are acutely hazardous, especially in concentrated form. Most have strong caustic or corrosive action, and as such should be clearly labeled with warning placards. Be sure to use protective gear especially for the face, eyes, hands and lungs.

ammonia calcium hydroxide
ammonia persulfate potassium hydroxide
ammonium fluoride sodium hydroxide
ammonium hydroxide

Cryogenic gases

Cryogenic means ultra-cold. These gases are usually stored in liquid form under high pressure and are used to heat and cool ovens in the process of seminconductor wafer fabrication. Some are used as 'carrier' gases, carrying dopants into the oven chamber. Hydrogen and oxygen are extremely flammable (they ignite and burn very easily). These gases have a potential to explode and thus require special storage and handling precautions. A major leak of liquefied gas can rapidly fill the workroom displacing oxygen and causing sudden death by asphyxiation.

argon hydrogen
carbon dioxide nitrogen
carbon monoxide oxygen
deuterium ozone
helium

Cyanides

Cyanides are a group of highly irritating and rapidly acting poisons. They are used for cleaning, plating and metallizing. Notice that most cyanide compounds (salts) contain a metal or mineral molecule. The biggest risk is exposure to cyanide in gas form, although they are often stored in solid or liquid form. Cyanide is quickly absorbed through the skin and lungs. It prevents the body tissues from taking up oxygen causing sudden death by asphyxiation. Repeated low-level exposure can cause severe dermatitis, thyroid disease, and muscle incoordination. Another highly reactive and poisonous group related to the cyanides are the isocyanates. Be extremely careful with any cyanide compound, and always wear a proper respirator if the process is not completely enclosed. Be sure cyanides are labeled clearly with warning placards.

calcium cyanide

copper cyanide

hydrocyanic acid

nickel cyanide

potassium cyanide

potassium ferrocyanide

sodium syanide

zinc cyanide

Dopants

Dopants are metal compounds in solid, liquid or gas form and are used to make chips. Dopants are sometimes called impurities. They are usually injected as a gas or vapour into ovens which are heated to extreme temperatures. When heated, the metal of the dopant is deposited in the semiconductor wafer, penetrating its surface and giving it the ability to conduct electricity. The metals more commonly used in doping include aluminum, antimony and arsenic. Boron and phosphorous are also commonly used. Dopants are considered to be potentially the most hazardous group of chemicals used in electronics. Most are highly toxic. If a leak or rupture occurs with a substance like phosphine, arsine, or the boranes, the whole factory and surrounding community can be affected with many cases of serious harm and sudden death. Argon and deuterium are sometimes used as carrier gases.

Gases Solids
arsenic pentafluoride aluminum
arsine antimony
boron trichloride antimony trioxide
boron trifluoride arsenic
diborane arsenic trioxide
diethyl telluride beryllium
dimethyl telluride boron
hydrogen arsenide boron nitride
hydrogen phosphide boron trioxide
pentaborane cadmium
phosphine chromium
phosphorus petafluoride gallium
selenium hexafluoride germanium
trichlorosilane phosphorus
phosphorus pentoxide
Liquids selenium
antimony trichloride tellurium
antimony trioxide tin
arsenic trichloride zinc arsenide
arsenic trioxide
boron tribromide
boron trichloride
boron trioxide*
phosphorus oxychloride
phosphorus pentoxide*
phosphorus tribromide
phosphorus trichloride
silicon tetrabromide
*with a solvent

Fillers

Fillers are powders or tiny fibres added to resins (plastics, epoxies, glues, paints) to give bulk, strength and form. They are durable and some resist heat, fire and electricity. Asbestos and chromates cause cancer, and fibreglass can cause serious lung problems if breathed in over a period of time. These substances can also be highly irritating to the skin and eyes. Fillers are used to make printed circuit boards and plastics. They are easily released as harmful dusts when resin products are shaped, sawn, or drilled. Avoid breathing and direct contact.

antimony trioxide quartz
asbestos silica
chromate pigments titanium
fiberglass

Metals (and their compounds)

Ordinarily, people do not consider that metals are chemicals. But they are, and many can be very harmful if swallowed or if breathed in small unnoticeable amounts day after day. Because metals are good conductors of electricity, they are widely used in electronics. Metals are used or occur in many forms - such as bulk solids, powders and liquid solutions suspended in gas form, and emitted as a fume when heated and as dust when drilled, sawn, or fiied. Exposure to the more dangerous forms of metal (gases, dusts and fumes) occurs more frequently during doping, soldering, plating, tinning and other metal work.

aluminum lithium
antimony manganese
arsenic mercury
barium molybdenum
beryllium nickel
boron phosphorus
calcium platinum
chromium rhodium
chromates selenium
cobalt silver
copper tantalum
iron tellurium
gallium tin
germanium titanium
gold tungsten
indium vanadium
lead zinc

Oxidizers

Oxidizers are highly reactive chemicals which can be used to clean or to render a metal surface free from corrosion. During oxidation, oxygen (from the oxidizer or from the air) combines with a metal or semiconductor surface to form a protective oxide layer. Some oxidizers have strong corrosive action and care must be taken to protect the eyes, skin and lungs from exposure. Oxidizers are also highly flammable and require special handling and storage arrangements.

ammonium persulfate nitrous oxide
cerric ammonium sulfate oxygen
chlorine ozone
chromic acid potassium iodide
hydrogen peroxide silver nitrate
iodine sodium persulfate

Resins (epoxies, curing agents, plastics)

There are many kinds of resins: plastics, epoxies, glues, adhesives, paints, waxes, synthetic rubber, synthetic fibres, and many others. With obvious exception of rosin (colophony) flux used in soldering, most resins used in electronics are man-made organic polymers. Polymers are complex chemical substances. Most contain many poisonous ingredients, such as solvents, dyes, stabilizers, fillers, plasticizers, catalysts and monomer residue. Some of these ingredients cause allergies, birth defects and cancer. Polymers are formed from monomers. Epoxides (epoxy resins) are normally cured with a phenol compound, and polyesters are cured with a peroxide compound. Uncured epoxy resins or monomers are very toxic and penetrate the skin and lungs rapidly. After they are reacted, cured, or set they are much less harmful, though dust created by shaping, cutting and drilling can be harmful. Resins are widely used in electronics, particularly in making printed circuit boards, moulding plastics, bonding, encapsulating and packaging, and are also used as wire coatings and a variety of other electrical insulation materials. Resins can produce a wide variety of highly toxic vapours and gases when heated or burning. Fires caused by burning plastic are sometimes very difficult to control.

Epoxy resins (epoxies) Polymers
diepoxybutane polyesters
diglycidyl ethers polyethylene
epichlorohydrin polystyrene
triethylene glycol diglycidyl ether polytetrafluoroethylene
polyurethane
polyvinylchloride
silicones
Curing agents (for epoxies) Resin ingredients/additives
adipic acid chlorinated diphenyls
amines formaldehyde
anhydrides ethyl acrylate
3,3'-dichlorobenzidine ethylene imine
diethyl amine fillers (see above)
diethylene triamine isobutene
dimethyl amine isocyanates
ethylene diamine isocyanates
ethylene triamine ketones
maleic anhydride methyl methacrylate
methylene dianiline phenol
MOCA styrene
organic acids (see Acids above) toluene diisocyanate
phthalic anhydride xylene
piperazine
Monomers
acrylonitrile
butene oxides
ethylene oxide
styrene oxide
vinyl chloride
vinyl cyclohexane dioxide

Semiconductors

Semiconductors are the basic raw material or substrate for making electronic devices. They are treated with dopants and other chemicals to give them special electrical capabilities. Semiconductor substances are sometimes made by chemical companies which specialize in supplying chemicals to the electronics industry.

cadmium sulfide

gallium arsenide

germanium

indium phosphide

silicon

Solvents

Solvents are used in nearly every phase of electronics manufacturing. They are used primarily for cleaning and degreasing, and for thinning plastics, resins, glues, inks, paints and waxes. There is a wide range of organic solvents, some very toxic and others only mildly toxic. The subgroups should be considered to have a better idea of specific hazard risks and uses.The aromatic compounds and the chlorinated hydrocarbons are perhaps the most dangerous groups of solvents since many of them are known to cause cancer and other serious diseases.

acetone glycidyl ethers
amyl acetate, sec- heptane
benzyi chloride hexamethyl disilazane
bis(chioromethyl)ether hexane
butyl acetate, n- hexanone,3-
butyi acetate, tert- isopropyl alcohol
butyl cellosoive kerosene
butyl glycidyl ether, n- methyl isobutyl ketone
carbon disulfide methyl cellosolve
carbon tetrachloride methyl ethyl ketone
carbon tetrafluoride methyl isobutyl ketone
cellosoive ethyl-2-pyrrolidone
cellosoive acetate methylene chloride
chiorobenzene naphtha
chloroform nitrobenzene
chlorotoluene nonane
cresoi glycidyl ether pentane
dichlorobenzene perchloroethylene
dichioromethyl ether, a,a- petroleum spirits
diglycidyi ether phenol
dimethyi formamide phenol cyclohexane
dioxane, 1,4- phenol glycidyl ether
ethyl acetate propyl alcohol
ethyl alcohol stoddard solvent
ethyl benzene styrene
ethyl chioride toluene
ethyl ether trichlorobenzene
ethyl formate trichloroethane, 1,1,1-
ethylene dichioride trichloroethylene
ethylene glycol trimethyl benzene
ethylidene chloride turpentine
freons xylene